DH-PI-01 Paper Board Interlayer Peel Strength Tester

Product Description

Introduction

Microcomputer interlayer bond strength tester is mainly used to determine the bond strength of paper and paperboard. It is suitable for single-layer and multi-layer paper and paperboard, including coating paper,paper and paperboard covered with synthetic polymer film. Not suitable for low basis weight, porous, soft or low density paper and board. The interlayer bonding strength refers to the ability of paper and cardboard to resist separation between layers. It is a reflection of the internal bonding ability of paper and cardboard. The internal bonding strength can be completely controlled. This is very important for processing multilayer paper and cardboard. Low bonding values or uneven distribution may cause problems when tiling paper and cardboard in offset presses using viscous inks;if the bond strength value is too high, it will cause processing difficulties and increase the cost of the company.This test has a wide range of applications in multi-layer cardboard such as boxboard, white cardboard, gray board, and white cardboard in the printing and packaging industries.

Technical Specifications:

Punch angle:90 degree

Resolution: 0.1 J / m2;

Measuring range: A range: (20-500) J / m2, B range: (500 - 1000) J / m2.

Inductor: SH30-5000-2V

Sample size: 25.4mm * 25.4mm

Sample clamping force: 0 - 40kg / cm2 (adjustable)

Unit: J / m2, lbf / in2 interchange

Interface: 3.2in LCD display

Printing: Modular all-in-one thermal printer

Appearance size: 52cm * 42cm * 70cm

Weight: 62kg